3D electromagnetic simulation software
1 min read
Agilent Technologies has today unveiled Electromagnetic Professional (EMPro) 2010, a new release of its 3D electromagnetic (EM) modeling and simulation software for analysing the 3D EM effects of IC packages, connectors, antennas and other RF components.
Used in the development of high frequency and high speed electronic devices, Agilent says the new release features 'significant improvements' in simulation speed and design efficiency.
Marc Petersen, product marketing lead in Agilent's EEsof EDA organization, said: "These improvements also provide a significant benefit to users of our Advanced Design System software, who are using EMPro within their design flow."
According to Agilent, some of the new capabilities available in EMPro 2010 include:
o Faster finite element method (FEM) simulations through meshing improvements and use of symmetry planes
o Built in acceleration of finite difference time domain (FDTD) simulations utilising graphics processor unit (GPU) hardware
o Enhanced FEM accuracy through the use of new sheet ports and material property models
o Improved design efficiency with a new bondwire component, ODB++ file support for printed-circuit-board designs, and several other new user interface features
o Microsoft Windows 7 support in addition to Microsoft Windows XP, Vista and Linux support.
