Engineering publications brought to you by Mark Allen

Product Launches

Embedded Systems

AAEON COM Express Module adopts latest Intel processor technology

CPUs

Renesas introduces RX261/RX260 microcontroller groups

Internet of Things

ST adds dual-wireless resilience to IoT module for metering and asset tracking

Power

Melexis launches 60W single-coil sensorless BLDC driver

Interconnection

Pasternack expands options for LMR and Low-PIM cable assemblies

Embedded & Programmable

Microchip’s RTG4 FPGAs achieve highest space qualification

Interconnection

High-temp FPC/FFC connector designed for automotive applications

Embedded Systems

Tria Technologies launches COM Express Type 6 Carrier Board

Power

AC/DC flyback controllers improve power efficiency and reduce standby power consumption

Power

Toshiba releases TCKE9 Series of eFuse ICs

ASIC & SoC

Synaptics’ Veros SoCs provide 'intelligent' connectivity

Sensors

Renesas targets IO-Link market with latest semiconductor solutions