Decoupling capacitor arrays target mil/aero applications
1 min read
AVX has expanded the applications of its LICA series of low inductance decoupling capacitor arrays.
Widely utilised in commercial and industrial five nines uptime applications, such as mainframe class cpus and ultimate performance multichip modules and communications systems, the MIL-PRF-123 tested devices also provide high reliability and low inductance advanced decoupling solutions for a variety of military and aerospace applications, including high pin count fpgas, asics, cpus, and other high power, high performance ics with low operating voltages.
Exhibiting <30pH ESL, the lowest ESL rating in the mil/aero market, the LICA series includes several low inductance design features.
Utilising up to four separate capacitor sections in a single ceramic case, the arrays feature low resistance platinum electrodes in a low aspect ratio pattern, double electrode pickup and perpendicular current paths.
The series is also the only product in the mil/aero market to feature C4 solder ball terminations, which enable minimal interconnect inductance and are the perfect complement to flip chip packaging technology.
