The device with two package types, I-PAK and D-PAK, will sample to customers in November this year and will be manufactured in high volume in the firs quarter of 2019.
The 90R1K4P features the maximum peak voltage of 950V and a breakdown voltage as high as 900V, which provides enhanced system stability and reliability. It's suited for high-voltage applications such as:
- an auxiliary power supply for industrial smart metering, which uses a three-phase input power to alternate current electric power generation, transmission, and distribution.
- the lighting of flyback topology in both AC/DC and DC/DC high-speed switching converters.
- a power supply for lighting equipment due to its characteristics of high stability that help prevent an unstable system condition that could lead to outages.
The device is able to increase its switching speed due to its low total gate charge (Qg), which reduces heat generation in the system, keeps power loss down and improves energy efficiency. It also enables smaller form factors than the High-Voltage Planar MOSFET, since the die size of 90R1K4P is more than 50% smaller under the same condition of conduction loss.
To enable the use of 90R1K4P product in small form factors, MagnaChip will house the device in a small I-PAK package type under the code MMIS90R1K4P. As a result of the die size reduction and choice of packaging, it will possible for the MOSFET to be adopted in a wide range of applications.
To ensure the 90R1K4P can be adopted for applications where space is at a premium, the company can mount the Super Junction MOSFET into the slim SMD (Surface-Mount Devices) package type, D-PAK.
