Rated at 40 V, 100 V and 150 V, the ‘flip chip’ formatting makes it simple for engineers to use with the new FCQFN devices easy to mount on PCBs using standard assembly equipment and processes.
40 V-rated FCQFN devices are available with an on-resistance value of 4.3 mΩ (3x4 mm chip size). 100 V HEMTs are offered with RDS(on) ratings of 2.8 mΩ (3x5 mm) and 1.8 mΩ (4x6 mm), while the 150 V-rated parts measuring 4x6 mm are available with 3.9 mΩ and 7 mΩ RDS(on).
The 40 V parts using Innoscience’s latest GaN processes achieve industry-leading performance with best-in-class figure-of-merit (FOM) values for Qgg*Ron and Idss*Ron.
The parts low drain and gate leakage currents enable them to be used in mobile markets and direct-battery-connected applications. Other applications include USB Type C buck-boost converters in laptops.
In addition, with its latest generation process, Innoscience maintains very tight control of the epitaxy, resulting in a very uniform threshold voltage and on-resistance, leading to a very high wafer yield.
100 V devices suit DC/DC conversion at power levels of up to 2 kW, due to their very low on-resistance. When used in parallel configuration, power levels up to 8 kW can be achieved.
The new 150 V targets industrial applications, including solar installations. They have been designed to be very rugged, so they do not need the industry-standard 80% derating to be applied (i.e. they are rated at 100% of their voltage). A
All the new 40 V, 100 V and 150 V HEMTs have been tested to and exceeded JEDEC and the GaN-specific JEP 180 standards.
One last important point to highlight is that the 1.8 mΩ 100 V HEMTs are pin-for-pin compatible with the new 3.9 mΩ and 7 mΩ 150 V parts as they are all packaged in FCQFN 4x6mm: this enables great design flexibility.
