The product is said to offer complete monitoring and easy scalability of the IPM, while comprising higher power density, true real-time junction temperature detection and secure authentication.
Infineon believes that through design flexibility and upgraded smart protection, the efforts for the powerstage development and running system are ‘greatly’ reduced. The hope is that SMEs will be empowered to implement semiconductors for existing and emerging applications.
The wiring of the MIPAQ Pro is designed to overcome space challenges and feature-set, to allow for replacing power units and sub-systems which are nominally 50% higher rated.
The result, Infineon said is real time condition monitoring makes safety buffers towards. For example, 150°C semiconductor junction temperature just a surplus.
Installing the MIPAQ Pro at the heart of an inverter makes changing topology very easy, according to Infineon. At the end of their production line, customers can choose between chopper and half-bridge modes via Modbus.
The safe operation area of the IPM is also said to be improved with ‘more robust’ boards and a software-upgrade leading to higher system availability. This, Infineon explained, is supported by different warning levels which can be adapted to specific use-cases helping system-operators to generate counter-measures before a potential fault-triggered system shutdown.
