This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s iTransient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution that's well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor.
High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization.
Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant.
Capacitors using KONNEKT technology have the ability to be mounted in a low-loss orientation to increase their power handling capability further.
Combining KEMET’s Class 1 C0G dielectric system with KONNEKT technology offers engineers a low-loss, low-inductance package that's capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature.
Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.
