Engineering publications brought to you by Mark Allen

Automotive

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

3D Linear Hall effect sensor simplifies rotary motion and proximity detection

Infineon announces acquisition of Marvell’s Automotive Ethernet business

ZF sees fibre optics as a key technology for future vehicle electrical systems

Hirose develops miniature carbon-ink-circuit connector for harsh environments

imec announces new accelerator to lead development of chiplet-based technology

Power PROFET + 24/48V smart power switch family targets automotive power distribution

TTTech Auto introduces Automotive Data Logger for SDV verification and validation

Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar

Mazda and ROHM developing automotive components using next-generation chips

ST delivers sensing accuracy with integrated low-side current-measurement amplifier

Nexperia introduces AEC-Q100 qualified 12-channel LED driver