Morse Micro launches the MM8102 Wi-Fi HaLow chip

Morse Micro, a provider of Wi-Fi HaLow chips, has announced the launch of the MM8102, a Wi-Fi HaLow SoC that's been tailored for mass IoT deployments in Europe and the Middle East.

The MM8102 Wi-Fi HaLow chip Credit: Morse Micro

A low-power variant of the MM8108, the MM8102 delivers 1 MHz and 2MHz bandwidth at 256-QAM modulation enabling throughputs up to 8.7Mbps, which significantly exceeds the speed of LoRaWAN networks. By utilising the sub-GHz ISM bands, the SoC also offers far greater range and signal penetration than conventional 2.4GHz, 5GHz and 6GHz Wi-Fi networks.

In addition, the MM8102 meets European and global regulatory requirements, simplifying development for IoT device manufacturers.

The MM8102 offers:

Regulatory compliance: Optimised for EMEA market, the MM8102 supports 1MHz and 2MHz bandwidths with 16dBm EIRP and full support for duty-cycle restrictions, ensuring full compliance with EU wireless regulations

Low power operation: Optimised for battery-operated applications with significantly extended sleep times and ultra-low power consumption in sleep modes

Highest performance for EMEA: Support for 256-QAM modulation offering burst throughput of 8.7Mbps at 2MHz bandwidth

EU duty cycle support: Full support for burst and average duty cycling to meet EU regulatory requirements, resulting in average throughput up to 867kbps for access points at 10% duty cycle and 243kBps for IoT stations at 2.8% duty cycle

With ultra-low power consumption and full Wi-Fi HaLow standards compliance, the MM8102 is intended for smart cities, industrial IoT, smart metering, point-of-sale, logistics, and large-scale sensor networks.

Additional features include:

USB, SDIO and SPI host integration: Improving ease of integration and enabling USB AP and STA dongle operation on new and existing network infrastructure

Enhanced security: Supports WPA3 with Simultaneous Authentication of Equals (SAE) and GCMP encryption for robust link-layer protection.

Scalable design: Compact 5 x 5 mm BGA package minimises printed circuit board (PCB) size and cost