Murata presents compact, ultra-low power Wi-Fi HaLow module

Murata has introduced a new series of HaLow modules (LBWA0ZZ2HK and LBWA0ZZ2HL) that are compliant with Sub-1 GHz (S1G) Wi-Fi standards across key regions.

Murata has introduced a new series of Wi-Fi HaLow modules Credit: Murata

Able to achieve high-speed communication over distances of more than 1km, these compact modules can support high power +23dBm (Type 2HK) and low power at +13dBm (Type 2HL) smart IoT applications.

They can be used in consumer smart devices, such as connected smart homes and smart accessories, as well as for business and industrial applications, including access control, smart energy solutions, building automation, security cameras, infrastructure management, and medical devices.

According to Murata by utilising long-range, high-speed communication for a private network, smart device and smart equipment, manufacturers will be able to change existing Wi-Fi/IP communication solutions to achieve area expansion while reducing radio usage and improving power consumption efficiency.

Due to their IP-native standard compliance with no network costs, the Type 2HK/2HL modules reduce the need for repeaters in existing Wi-Fi/IP communication-based solutions, enabling private network area expansion and lowering system costs.

Additionally, compared to other low-power, wide-area (LPWA) network technologies, the long-range, high-speed communication of the modules can facilitate image and video transmission which can be used for IoT deployments to inspect and maintain infrastructure and hazardous areas outside of cellular coverage, enabling automation with significant energy and cost savings.

Based on the NRC7394 chipset from NEWRACOM with ARM-based Cortex-M3 processors the Type 2HK/2HL modules offer enough processing power to accommodate the Wi-Fi subsystem and user applications.

The Type 2HK module operates at frequencies from 902MHz to 928MHz, whereas the Type 2HL is at 750MHz to 950MHz. Both modules feature an SPI host interface with peripherals including SPI, 2x UART, 2x I2C, 2-channel 10-bit ADC and GPIO.

Housed in a surface-mount LGA package with solder bumps, the modules typically measure 19mm by 13.9mm, have a maximum profile of 2.5mm, and operate in a temperature range from -40°C to +85°C.