Housed in a TCPAK57 package measuring just 5mm x 7mm, the Top Cool devices feature a 16.5mm2 thermal pad on the top side that allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.
The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1mΩ. In addition, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.
The TCPAK57 initial portfolio includes 40V, 60V and 80V with all devices capable of operating at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable. This, along with their gull wings that allows inspection of solder joints and superior board level reliability, makes them suited to demanding automotive applications.
The target applications are high/medium power motor controls such as electric power steering and oil pumps.
Samples of the new devices are now available with full-scale manufacture planned in January 2023.
