The EliteSiC SPM 31 IPMs have been designed to deliver improved energy efficiency and power density in a much smaller form factor, when compared to using Field Stop 7 IGBT technology.
The device’s improved thermal performance, reduced power losses and ability to support fast switching speeds makes them suitable for three-phase inverter drive applications such as electronically commutated (EC) fans in AI data centres, heat pumps, commercial HVAC systems, servo motors, robotics, variable frequency drives (VFDs), and industrial pumps.
The EliteSiC SPM 31 IPMs offer several current ratings from 40A to 70A. Complemented by onsemi’s IGBT SPM 31 IPM portfolio, covering low currents from 15A to 35A, onsemi is now able to provide one of the broadest ranges of scalable and flexible integrated power module solutions in a small package.
As electrification and AI adoption grow, particularly with the construction of more AI data centres, increasing energy demands and the need to reduce the energy consumption of applications in this sector is becoming more critical.
For example, with the number and size of data centres growing, the demand for EC fans is expected to rise. These cooling fans maintain the ideal operating environment for all equipment in a data centre and are essential for accurate, error-free data transmission. The SiC IPM ensures the EC fan operates reliably and at its highest efficiency.
Like many industrial applications such as compressor drives and pumps, EC fans require higher power density and efficiency than existing larger IGBT solutions can provide. By switching to EliteSiC SPM 31 IPMs, customers will be able to benefit from a smaller footprint, higher performance, and a simplified design due to high integration, resulting in shortened development time and lower total system cost in addition to reduced GHG emissions.
Compared to a system solution that uses a current IGBT power integrated module (PIM) with power losses of 500W at a 70% load, by implementing highly efficient EliteSiC SPM 31 IPMs it’s possible to reduce the annual energy consumption and cost per EC fan by 52%.
The fully integrated EliteSiC SPM 31 IPM consists of an independent high side gate driver, low voltage integrated circuit (LVIC), six EliteSiC MOSFETs and a temperature sensor (voltage temperature sensor (VTS) or thermistor). The module is based on the M3 SiC technology that shrinks die size and is optimised for hard-switching applications with improved short-circuit withstand time (SCWT) performance when used in the SPM 31 package, making them suitable for inverter motor drives for industrial use.
The MOSFETs are configured in a three-phase bridge with separate source connections for the lower legs for maximum flexibility in the choice of control algorithm.
Other benefits from the SPM 31 include:
- Low loss, short-circuit-rated M3 EliteSiC MOSFETs to prevent catastrophic equipment and component failures such as electric shock or fire.
- Built-in under-voltage protection (UVP) to protect against damage to the device when voltage is low.
- As the peer-to-peer product of FS7 IGBT SPM 31, customers can choose between various current ratings while using the same PCB board.
- UL certified to meet national and international safety standards
- Single-grounded power supply offering better safety, equipment protection and noise reduction.
- Simplified design and reduced size of customer boards.