Photocoupler offers compact replacement for DIP4 packaged devices
Toshiba's latest transistor output photocoupler is available in a low height, wide body SO6L package, which the company says can be used to replace conventional DIP4 packages.
The TLP385 offers a high isolation performance. It guarantees a minimum creepage and clearance distance of 8mm and isolation voltage of 5kVrms (min).
With a height of just 2.3mm (max) – a 45% reduction from DIP4 type package products – the TLP385 can be used in situations where there are strict height limits, aiding the development of ultra low profile products. It can be used for applications including inverter interfaces and general-purpose power supplies.
Operating temperature range is between -55 and 110°C. It is approved to UL, cUL and CQC safety standards and is also available as VDE EN60747-5-5 approved type.
