Power mosfets with reduced top side thermal impedance
1 min read
Texas Instruments has introduced what it claims to be the industry's first family of standard footprint power mosfets that dissipate heat through the top of the package for high current dc/dc applications.
According to TI, DualCool NexFET power mosfets reduce end equipment size, while providing up to 50% more current through the mosfet and improving thermal management over other standard footprint packages.
This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These mosfets in an advanced package can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, basestations, and high current industrial systems.
"Our customers demand higher current dc/dc power supplies in a smaller footprint to meet the need for increased processing power in the broad infrastructure market," said Steve Anderson, TI's senior vice president and worldwide manager, Power Management. "DualCool NexFET power mosfets meet this need by conducting more current in the same form factor."
