Renesas debuts ultra-low-power RA4L1 MCUs targeting IoT sensing and HMI applications

Renesas Electronics has introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support.

Ultra-low-power RA4L1 MCUs Credit: Renesas

Based on an 80-MHz Arm Cortex M33 processor with TrustZone support, these new MCUs deliver a combination of improved performance, features and power savings that will enable designers to address a range of applications, including water meter, smart locks, and IoT sensors.

The RA4L1 MCUs employ proprietary low-power technology that delivers 168 µA/MHz active mode @ 80 MHz and standby current of just 1.70 µA with all the SRAM retained. They are also available in very small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), addressing the needs of products such as portable printers, digital cameras and smart labels.

The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP) which enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions.

It allows customers to integrate their own legacy code and choice of RTOS with FSP, providing designers with full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.

Key features of the RA4L1 MCUs:

Core: 80 MHz Arm Cortex-M33 with TrustZone

Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash

Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock

Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100

Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash

Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option

The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK).