ST unveils its DOCSIS 3.1 chipset solution

STMicroelectronics has announced the STiD325, its next generation DOCSIS 3.1 device for data gateway applications. It can also be used as cable modem, eMTA (embedded Media Terminal Adapter) or as a front-end device for headed cable multimedia gateway applications.

The STiD325 is built around a multi-Gigabit DOCSIS 3.1 modem fully certifiable by Cable Labs with full DOCSIS 3.0 backward compatibility. Besides DOCSIS modem, it embeds line-rate hardware-accelerated switching, routing, Wi-Fi bridging and a carrier grade telephony engine.

The STiD325 is powered by a multi-core 64-bit ARM CPU which offers up to 10,000DMIPS and comes pre-integrated with a RDK-B software allowing OEM to deliver and customise efficiently advanced and future proof CPE (Customer Premises Equipment) solution to MSO's (Multiple System Operators).

Using 28nm FD-SOI silicon technology, the STiD325 provides a cost-effective path for operators towards large-scale deployments.