This is the first member of Tria’s COM-HPC Mini modules and is intended for system designs that require a combination of performance and flexible IO connectivity in the smallest possible space.
The module is based on the 13th Gen Intel Core H-, P, or U-series processors, offering high-end, scalable CPU compute performance on a small form factor. This enables system designers to pick from a variety of energy efficient and performance options scaling up to fourteen cores and twenty threads at 15 to 35W thermal design power.
In addition, the Intel Iris Xe Graphics Engine with up 96 execution units helps to accelerate graphics, media and AI intensive tasks.
The module delivers enhanced computational performance and functionality for system designs working with restricted space and cooling, explained Daniel Denzler, Senior Director, Business Line Manager, Tria Technologies.
“That’s what makes this particular board ideal for mission critical equipment that has to operate 24/7 even under extreme environmental conditions and considerably broadens our product portfolio to support key markets in automation, robotics, medical, and transportation,” Denzler added.
The module is equipped with soldered memory of up to 64GB, in-band ECC data protection, and optional local NVMe.
The board features a variety of high-speed IO including PCI Express Gen 4, USB4, USB3.2, USB2.0, dual Gb Ethernet, MIPI-CSI, SATA, and serial ports. Multiple display options allow users to connect up to four external displays via DDI, eDP, and USB4 interfaces, carrying four independent display streams.
Tria ensures long-term availability of the product, designed and manufactured in Germany and further investment protection is provided with 100% compliance to the COM-HPC open industry standard.
System solutions will benefit from performance and technology upgrades by migrating to future module generations, when they become available.
