Consequently, it is suitable for edge applications that demand both greater processing power and more versatile connectivity.
The module is powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It has been designed for high-performance, battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.
The COM-HPC-mMTL comes with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).
Despite its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.
The COM-HPC-mMTL also ensures that high-performance embedded solutions are now possible even in tight spaces, offering a balance of power, size, scalability, and a stackable design that maximises space efficiency without impacting functionality for next-generation edge applications.
ADLINK offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, which will be available in the second half of 2025.
