Epoxy Adhesive/Sealant for Service up to +400°F
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Master Bond Supreme 11HT-LO is a two component, room temperature curing epoxy adhesive/sealant that meets NASA low outgassing specifications. Serviceable from -100°F to +400°F, this high temperature resistant system also features high peel and lap shear strengths.
Master Bond Supreme 11HT-LO is formulated for use in the most difficult applications in the aerospace, electronic, electrical, computer and chemical industries for up to 400°F service.
It passes NASA low outgassing testing as per ASTM E595 specifications.
Supreme 11HT-LO combines the convenience of a fast room temperature cure with a uniquely favorable performance profile. This two part epoxy system delivers high shear and high peel strengths, exceeding 2,000 psi and 15 pli at room temperature, respectively. The hardened adhesive is a superior electrical insulator.
Supreme 11HT-LO produces durable, exceptionally tough bonds which are remarkably resistant to severe thermal cycling. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking, while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. This adhesive/sealant can also withstand many chemicals including water, oil, fuels and some organic solvents even upon prolonged exposures. Its adhesion to metals, glass, ceramics and many plastics is excellent.
This system emphasizes easy handling with its one to one mix ratio by weight or volume. Color coding makes mixing easy with Part A colored gray and Part B colored amber. Once properly mixed, it spreads evenly and smoothly, with only contact pressure required for cure. Supreme 11HT-LO is 100% reactive and does not contain any diluents or solvents, or any hazardous ingredients.