Electrically Insulating Epoxy Offers Outstanding Thermal Conductivity

Master Bond EP21TDC-2AN is a two component epoxy resin compound featuring excellent thermal conductivity and superior electrical insulation properties. This flexibilized system is well suited for high performance bonding, sealing, coating and encapsulation applications.

Master Bond EP21TDC-2AN is a versatile system that offers the structural benefits of an epoxy, yet incorporates flexibility and very impressive thermal conductivity. It is widely used in the electronic, electro-optical and related industries. This two part epoxy system's exceptional thermal conductivity is particularly noteworthy at more than 3 W/m/K at room temperature. It exhibits tensile shear and peel strengths in excess of 800 psi and 15 pli, respectively for bonding and sealing. It adheres well to a wide variety of substrates including metals, glass, ceramics, rubbers and many plastics. This cured adhesive is an excellent electrical insulator. EP21TDC-2AN offers superior resistance to a wide variety of chemicals including water, fuels and many solvents. The flexible system excels at withstanding thermal shock, thermal cycling and mechanical shock. It features a service temperature range of 4K to 250°F and has been successfully employed in a number of cryogenic applications. It is formulated to fully cure at ambient temperature or more quickly at elevated temperatures with an easy to handle one to three mixing ratio by weight. The cured compound exhibits a high elongation (greater than 25%); truly exceptional for a thermally conductive epoxy. After mixing EP21TDC-2AN generates a very low exotherm, which allows for a long working life. The color of Part A is light gray; Part B is gray.