Engineering publications brought to you by Mark Allen

ST enhances sensing creativity with MEMS Studio desktop software solution

Hirose develops right-angle crimp socket for DF60 series

Nisshinbo launches boost/flyback switching regulator controller

Microchip expands Serial SRAM portfolio with larger densities and increased speeds

SECO and NXP collaborate to bring Clea to industrial and IoT applications

Taking test to the next level

Jump in smartphone sales predicted

Amazon pours additional $2.75bn into Anthropic

Winbond extends secure flash family with new memory densities andPQC support

NXP introduces the Open S32 CoreRide platform

Silicon Motion unveils latest generation FerriSSD BGA SSD

SEMIFIVE commences mass production of 14nm AI inference SoC platform