Engineering publications brought to you by Mark Allen

Ceva introduces latest IP for FiRa 2.0 targeting IoT applications

Infineon unveils high density power modules for AI data centres

ARM and Nuro announce L4 partnership

Microchip launches dsPIC DSC-based integrated motor drivers

SiC inverter control modules enable more efficient electric motor drivetrains

Crypto Quantique IoT security solutions now support cellular connectivity

First automotive-grade CMOS image sensor with RISC-V IP SoC

Intel and Cadence expand SoC design partnership on Intel's advanced processes

ST expands into 3D depth sensing with ToF sensors

Synopsys and Intel Foundry deepen collaboration covering EDA flows and IP portfolio

Analog Devices extends partnership with TSMC

Weebit Nano demonstrates ReRAM high reliability and performance