Engineering publications brought to you by Mark Allen

EBV launches Product Innovations department

High power density and extra wide input bricks target demanding applications

Hybrid nanostructures may be right for next-gen green cars

A to C, Toby make USB easy

LEMO’s rugged, high density, IP rated connectors suit defence and hi-rel applications - Space-saving, multi-pin, fully shielded, vibration-secure and sealed connector with high pin-count density, 360° EMC shielding protection

TSMC says ‘good progress’ with EUV

The best of times or the worst?

Virtualised 5G architecture world first

Omron LED Control IC provides ultra-smooth fade

EDS: New features and innovations pull in visitors

New Micro:bit Educational Foundation launched

100G technology for hyperscale data centres and cloud computing environments