Engineering publications brought to you by Mark Allen

Samsung narrows Intel’s global chip market lead in Q2

Chirp and Arduino partner

Harwin introduces ready-made cable assemblies for its Datamate connectors

VCS-1 embedded processor module for precision robotics

Diodes looks to buy Lite-On Semi

Conrad Electronic simplifies procurement of products and services

Marvell extends NVMe-oF Ethernet SS technology leadership

High-density 3D stack test chip

Semtech and Murata sampling new LoRa-based modem platform

Winbond memory chip now supports NXP Layerscape LS1012A

First blueprint for human robot interaction launched

Sensorless control pre-driver IC for BLDC motors