Engineering publications brought to you by Mark Allen

Audio technology

Renesas expands RISC-V embedded processing portfolio

Embedded World: Combo wireless module combines Wi-Fi 6, Bluetooth and IEEE 802.15.4 LR-WPAN connectivity

sureCore introduces ultra-low power memory IP range for power critical designs

Audio unbound

Fluent.ai offers embedded voice recognition for TWS products

Infineon ecosystem drives adoption of multilevel Class D audio amplifier technology

Dirac and BES to offer Dirac-enabled BES chipsets to headphone manufacturers

Dirac expands collaboration with NXP with automotive audio solutions

Cadence Tensilica HiFi DSP supports Dolby Atmos for cars

Dirac joins with BlackBerry QNX to improve in-car audio experience

CEVA joins Intel Pathfinder for RISC-V programme

POLYN Technology signs first customer for NASP Tiny AI chips