The Dimensity 7400 and 7400X are geared to deliver advanced gaming and AI camera technology, while the Dimensity 6400 provides enhanced 5G capabilities.
Both Dimensity 7400 chipsets integrate an octa-core CPU with 4x Arm Cortex-A78 cores operating up to 2.6GHz and 4x Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU.
Built on TSMC’s 4nm process node, these chipsets use between 14% to 36% less power when gaming compared to competitive chipsets. In addition, the SoCs feature MediaTek Advanced Gaming Technology (MAGT) 3.0 support for improved graphics performance, AI optimisations that adjust game settings based on the device’s workload, reduced input lag for quicker response, and advanced power savings.
“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business.
To boost the performance of AI applications, Dimensity 7400 and 7400X integrate MediaTek’s NPU 6.0, with a 15% upgrade in performance over the Dimensity 7300. Offering premium multimedia capabilities with an Imagiq 950 high-end signal processor (ISP), both support advanced AI camera features even in low lighting. The chips also have Google Ultra HDR support for higher dynamic range, more vivid colours, and better contrast for photos and videos. This ensures that photos and videos retain their quality when uploading from a user’s smartphone to social media.
Additional features include: support for dual display flip phones (7400X) to give OEMs more design flexibility; a 5G R16 modem with 3CC carrier aggregation (3CC-CA) that leverages MediaTek’s UltraSave 3.0+ technologies to provide 20% lower power compared to competitor devices and Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
The newest entry in the Dimensity 6000 series of more affordable chipsets enhances the latest 5G connectivity features to make them accessible to users around the world. The Dimensity 6400 utilises an octa-core CPU with 2x Arm Cortex-A76 cores operating up to 2.5GHz and 6x Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU.
Built on TSMC’s 6nm process node, Dimensity 6400 runs efficiently, using up to 19% less power when gaming compared to competitor chipsets.
The first smartphones powered by the MediaTek Dimensity 7400 and 7400X will be available in Q1 2025.
