Engineering publications brought to you by Mark Allen

Consumer

Qorvo introduces next-generation Matter solution

Peratech closes $31.5m funding round to support its tactile sensing and haptics products

Syntiant introduces small language model assistant

Blue Cheetah and LG demonstrate successful silicon bring-up of chiplet-based design

Price challenges for memory loom in second half of 2024

Revolutionising TWS earbuds with ultrasonic MEMS speakers

OMNIVISION introduces small-format 50-megapixel image sensor

Global notebook shipments expected to grow by 3.7% in 2024

More than half of connected devices will be haptic enabled by 2028

xMEMS introduces active micro-cooling “Fan on a Chip”

The Future of Retail

14% of PCs shipped globally in Q2 2024 were AI-capable