According to xMEMS Labs, for the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, and other advanced mobile devices with this silent, vibration-free, solid-state chip, which is just 1mm thin.
“Our µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”
The XMC-2400 measures just 9.26 x 7.6 x 1.08mm and weighs less than 150mg, making it 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic cms of air per second with 1,000Pa of back pressure. The all-silicon solution offers reliability, part-to-part uniformity, high robustness, and is IP58 rated.
xMEMS µCooling is based on the same fabrication process as the sound-from-ultrasound, xMEMS Cypress full-range micro speaker for ANC in-ear wireless earbuds, which will be in production in Q2, 2025 with several customers already committed to the device. xMEMS plans to sample XMC-2400 to customers early in 2025.
“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang continued. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”
xMEMS will begin demonstrating XMC-2400 to lead customers and partners in September at its xMEMS Live events in Shenzhen and Taipei.
