Engineering publications brought to you by Mark Allen

Electronics

NIO and NXP collaborate on 4D imaging radar deployment

Top tips for great audio

Packing a punch

Germany may restrict export of chip chemicals to China

Top 10 IC design houses see revenues drop almost 10 per cent in Q4 2022

Transphorm introduces new SuperGaN FETs in Standard PQFN packages

Microsoft/Activision Blizzard deal blocked

Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems

Q5d unveils robot for automating wiring harness manufacturing

TTTech Auto launches ECU to future-proof automotive E/E architectures

Cadence accelerates adoption of TSMC N3E and N2 process technologies

Infineon and SCHWEIZER to develop more efficient silicon carbide automotive solutions