Engineering publications brought to you by Mark Allen

Electronics

AI to deliver faster design and development in electronics

Worldwide smartphone shipments to recover in 2024

ST to build the world’s first fully integrated silicon carbide facility in Italy

Scalable quantum computing

First quantum computing demonstrator for the DLR QCI

MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Arm unveils CSS for Client initiative

CGD signs agreement with ITRI to develop GaN-based power supplies

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Malaysia looks for over $100bn in semiconductor industry investment

Epic Venture Partners invests $8.1m in Rain AI

Dolphin Design and Raspberry Pi offer advanced chip power management