Engineering publications brought to you by Mark Allen

Electronics

AI start-up Axelera AI closes $27m Series A funding round

Molex expands North American manufacturing capabilities

What we can learn from the energy efficiency of supercomputers?

Innoscience announces full range of 650V E-mode GaN HEMT devices

Marvell unveils 3nm data infrastructure IP portfolio

Microchip unveils Arm-based PIC MCU making it easier to add Bluetooth LE connectivity

Cadence expands collaboration with Samsung Foundry to advance 3D-IC design

Five billion phones to be thrown away in 2022

Würth Elektronik components now available via CELUS Engineering Platform

PragmatIC leads £2.4mn project to develop sustainable manufacturing technologies

Pickering Electronics signs distribution agreement with Farnell

Andes delivers first RISC-V CPU IP with ISO 26262 full compliance