Engineering publications brought to you by Mark Allen

Ics

Infineon brings audio portfolio together under one brand

Analog Devices launches integrated microwave upconverter and downconverter

Collaboration to simplify next-generation semiconductor and RF development

Trojans aren’t restricted to the software domain

ICs compliant with Bluetooth Ver. 5.0

Leti demonstrates 300mm wafer-to-wafer direct hybrid bonding with pitch dimension of just 1µm

Terahertz spectroscopy goes nano

STMicroelectronics unveils USB Type-C controllers with internal protection

Current sensor ICs with high precision programming

Wide body compact gate driver variants feature increased creepage distance

BLE modules and software provide IoT developers design flexibility and cost savings

Toshiba develops process technologies