Engineering publications brought to you by Mark Allen

Machine learning

Updated sensAI stack delivers more accurate, low power AI solutions

Telensa joins Qualcomm Smart Cities Accelerator Program

RAM scoops up computation

Arrow Electronics announces Artificial Intelligence Experience Tour

AI: Changing the face of defence

High-density 3D stack test chip

Microchip enters memory infrastructure market

The death of big data?

Bringing AI to navigation

Banking is dead, long live banking!

EDA learns from experience

Xilinx unveils first customer shipments of Versal ACAP