Engineering publications brought to you by Mark Allen

Memory

Samsung narrows Intel’s global chip market lead in Q2

Winbond memory chip now supports NXP Layerscape LS1012A

Microchip delivers analogue embedded SuperFlash technology

BittWare announces strategic investment in Eideticom

Microchip enters memory infrastructure market

Everspin expands spin-transfer torque MRAM ecosystem

XL-FLASH storage class memory solution

US start-up puts AI Core in SSDs

Rambus to acquire Northwest Logic

SMART Modular announces rugged S5E SLC NAND-based solid state drive

Electronic chip looks to mimic the brain to make memories in a flash

Winbond supports accelerated roll-out of 5G CPE modems