Engineering publications brought to you by Mark Allen

Memory

Samsung completes validation of industry’s fastest LPDDR5X

Teledyne e2v 8 GB DDR4 memory chip targets high reliability space applications

OPENEDGES validates its 7nm HBM3 testchip

How secure is your embedded device?

KIOXIA introduces 2Tb QLC flash memory with latest BiCS FLASH technology

Swissbit expands PCIe portfolio

NY CREATES and CEA-Leti unveil strategic research partnership

CEA-Leti announces launch of FAMES Pilot Line

Kalray and Pliops announce plans to merge

Synthara raises $11mn to increase performance of embedded chips

SureCore unveils low power cryogenic memory technology

Weebit Nano and Efabless collaborate to enable prototyping of SoC designs