Engineering publications brought to you by Mark Allen

Semiconductor

Kneron unveils next-generation AI chip

Bizen receives investment to expedite delivery of first product

Researchers develop neurotransistor

Imec and GLOBALFOUNDRIES announce AI chip breakthrough

Picocom selects UltraSoC for 5G New Radio small cell SoC

Moortec's new distributed thermal sensor based on 5nm technology

High power speaker amp ICs for advanced instrument clusters

Socionext prototypes low-power AI chip

Winbond unveils industry-first x64 LPDDR3 memory chip

First wireless communication across UHF using a printed semiconductor

High voltage DC-DC power module for scientific and semiconductor applications

A 'Golden Age' of architecture