Engineering publications brought to you by Mark Allen

Smartphones

NXP enables advanced Wi-Fi 6 performance for Honor Magic V

Touch controller supports new-generation AMOLED energy-saving displays

New level translators support legacy and future mobile phone SIM cards

MediaTek announces the Dimensity 9000+

Microchip extends its 8-bit PIC and AVR MCU portfolio

Imint debuts Vidhance Photo Zoom Stabilization solution

MediaTek launches Dimensity 8000 5G chip series

Upgrading to ULC smartphones

Samsung to target smartphone growth in 2022

Smartphone battery protection & fast-charging

ST unveils 70W high-power chipsets

First 176-Layer NAND mobile solution