Engineering publications brought to you by Mark Allen

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Kneron KL720 SoC uses a 1Gb LPDDR3 DRAM die from Winbond

Imagination and Packetcraft partner to deliver low energy audio

Microchip looks to leverage RISC-V ISA

Analog Devices announces complete audio system

Dolphin Design releases first development platform on TSMC 22ULL process

S2C and Mirabilis announce design team-up

Socionext and Osaka University develop deep learning method for object detection

MediaTek introduces latest 5G SoC/Dimensity 800U

SiFive unveils new custom silicon business unit

Picocom selects Andes N25F RISC-V cores for 5G SoC

SiFive enhances processor IP portfolio

MediaTek announces latest 5G chip