Engineering publications brought to you by Mark Allen

Bota Systems raises $2.5m in seed round

Littelfuse announces 800 V N-Channel depletion mode MOSFET

CUI Devices launches thermal design services

HMD starts manufacturing 5G smartphones in Europe

Microchip’s RT PolarFire FPGA achieves QML Class Q qualification

XCAM secures additional UK Space Agency funding for space camera system

Delivering state-of-the-art chip designs

Apple announces plans to hire UK AI staff

Exeger and Matrix Industries to develop low-power solutions for electronic devices

Automotive power-management ICs integrate CAN FD and LIN for simpler car-body controllers

Kneron raises $49m in additional funding

Pharrowtech and 8devices announce 60GHz wireless module collaboration