TI’s new 100V integrated gallium nitride (GaN) power stages feature thermally enhanced dual-side cooled package technology to simplify thermal designs and achieve the higher power density in mid-voltage applications at more than 1.5kW/in3.
The company’s 1.5W isolated DC/DC modules with integrated transformers are said to be the industry’s smallest and most power-dense, helping engineers shrink the isolated bias power-supply size in automotive and industrial systems by as much as 89%.
TI’s new 100V GaN power stages, LMG2100R044 and LMG3100R017, will enable designers to reduce power-supply solution size for mid-voltage applications by more than 40% and achieve power density of over 1.5kW/in3, enabled by GaN technology’s higher switching frequencies.
The new portfolio also reduces switching power losses by 50% compared to silicon-based solutions, while achieving 98% or higher system efficiency given the lower output capacitance and lower gate-drive losses.
According to TI a key enabler of the thermal performance in the 100V GaN portfolio is TI’s thermally enhanced dual-side cooled package. This technology enables more efficient heat removal from both sides of the device and offers improved thermal resistance compared to competing integrated GaN devices.
With over eight times higher power density than discrete solutions and three times higher power density than many competing modules, TI’s new 1.5W isolated DC/DC modules also deliver the highest output power and isolation capability (3kV) for automotive and industrial systems in a 4mm-by-5mm very thin small outline no-lead (VSON) package.
With TI’s UCC33420-Q1 and UCC33420, designers will be able to meet stringent electromagnetic interference (EMI) requirements, such as Comité International Spécial des Perturbations Radioélectriques (CISPR) 32 and 25, with fewer components and a simple filter design.
The new modules use TI’s next-generation integrated transformer technology, which eliminates the need for an external transformer in a bias supply design. The technology allows engineers to shrink solution sizes by more than 89% and reduce height by up to 75%, while cutting bill of materials by half compared to discrete solutions.
