Engineering publications brought to you by Mark Allen

Designing for high stakes

Flex Logix unveils InferX for DSP and AI inference

Marvell demonstrates 3nm data infrastructure silicon

Winbond joins STMicroelectronics partner programme

Arm plans to make its own semiconductor - report

Esperanto Technologies running generative AI models on low-power RISC-V architecture

High-efficiency buck converters provide POL design versatility

eMemory's security-enhanced OTP qualifies on TSMC N5 process

StoreDot partners with Vines to accelerate XFC battery technology development

National Software Testing Academy looks to address UK talent shortage

Trackwise awarded King’s Award for Enterprise for Innovation

Electrically conductive sealant offers high level EMI shielding