The collaboration moves to optimise integration and performance and assure long-term availability of both Winbond and ST devices to meet the needs of customers serving industrial markets.
“With Winbond and ST working together within the structure of the ST Partner Program, product developers can confidently integrate our memory with STM32 devices,” said Sierra Lai, Mobile DRAM Director, Winbond. “Our memories are a great choice for embedded projects, offering attributes such as small size, power-saving design, and low pin-count packages that simplify interconnection and save PCB cost.”
ST’s STM32 family is built on Arm Cortex 32-bit cores and, across almost 20 series of devices looks to optimise performance, energy efficiency, and advanced peripherals to serve the full spectrum of industrial, computing, and consumer applications. Moreover, its extensive STM32 ecosystem that comprises software, tools, and evaluation boards and kits, from ST and other ST Authorised Partners, helps to both simplify and accelerate development.
“The ST Partner Program is a high-value offering that has exceeded the expectations of our customers and partners helping design teams access strong supplemental skills, tools, and resources that meet design time-to-market challenges across the full ecosystem of products and services while easily integrating ST devices in their projects,” said Alessandro Maloberti, Partner Ecosystem Director, STMicroelectronics. “By selecting, qualifying, and certifying ST Authorised Partners, customers know that the partners they engage have the expertise to accelerate their design and development activities and ensure they ship the most robust and efficient products and services to market.”
Working with ST, Winbond is currently focused on combining its DDR3 (double data-rate 3rd generation) dynamic RAM with ST's STM32MP1 series MPUs, which contain up to two Cortex-A7 cores and integrate features including advanced peripherals, IoT-security hardware and associated certifications, and high power-efficiency circuitry on-chip.
Winbond's DDR3 supports the MPU's memory buffer to enhance performance in applications such as Industry 4.0, smart Homes, smart metering and HMIs that require both high performance and state-of-the-art security.
Becoming an authorised partner extends a collaborated that has already ensured Winbond's HYPERRAM provides support for the memory buffer of ST's recently announced STM32U5 ultra-low-power MCUs based on the advanced Cortex-M33 core. HYPERRAM allows replacement of older interfaces like SDR and earlier DDR generations to realise whole-system power savings and permits a high-speed, low-cost, low pin-count, and super-low-power solution consistent with the ultra-low-power STM32U5.
