Engineering publications brought to you by Mark Allen

Capture more, Automate more, Understand more

TeraSignal introduces TSLink architecture

ST delivers first FIPS 140-3 certified TPMs for computer, server, and embedded systems

Dukosi’s Cell Monitoring chipset ready for volume production

Peratech closes $31.5m funding round to support its tactile sensing and haptics products

Case study: AI facial recognition used to tackle retail crime

Infineon introduces the XENSIV PAS CO2 5V sensor

LDO regulator for high quality audio devices

BQP demonstrates quantum-based large-scale fluid dynamic simulations

Syntiant introduces small language model assistant

Yokogawa releases DLM3000HD Series oscilloscopes and new Classic Data Viewer software

Synopsys powers UCIe-based multi-die designs with IP operating at 40 Gbps