Engineering publications brought to you by Mark Allen

Neil Tyler

Interconnection

Dual USB2.0 and USB3.0 FeedThrough connectors available from Cliff Electronics

Electronics

NXP set to acquire Edge AI pioneer Kinara in $300m deal

Artificial Intelligence

A serious competitor

Electronics

CEA-Leti FAMES pilot line extends research opportunities

Semiconductors

Global semiconductor sales exceed $600 billion for the first time in 2024

Distribution

TTI announces global distribution partnership with Samtec

EDA & Design Software

Axiomise launches footprint, area analyser for silicon design

Materials

Integrals Power’s LMFP cell chemistry delivers 92% capacity retention at 5C discharge rates

Distribution

DigiKey expands downloadable CAD Model offering

Memory

Paragraf and University of Cambridge awarded grant for graphene memory device project

Embedded Systems

SEGGER enhances SystemView with multicore support for advanced real-time analysis

Wireless Technology

u-blox expands NORA-B2 Bluetooth LE modules series