Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Valeo & ROHM Semiconductor co-develop next generation power electronics

Electronics

Battery startup Molyon raises $4.6 million to support sustainable battery development

Rail & Marine

TDK expands CN-B110 series with 50W, 100W, and 150W quarter brick models

Space

Rocket Lab signs $23.9m CHIPS Incentives Award

Internet of Things

Murata presents compact, ultra-low power Wi-Fi HaLow module

Communications

Using AI to build next generation wireless systems

Policy & Business

From bad to worse!

Robotics & UAVs

Renesas presents high performance quad-core application processor

Interconnection

Amphenol RF introduces additional AUTOMATE Type A mini-FAKRA configurations

Aerospace

Aeluma secures NASA contract for quantum dot PICs for aerospace and AI applications

ASIC & SoC

ST delivers low-power, long-range wireless microcontrollers

Interconnection

USB 2.0 Type C connectors feature space-saving package sizes