Engineering publications brought to you by Mark Allen

Neil Tyler

Interconnection

Ultra-compact Hybrid FPC-to-Board Connector from Hirose

Audio Technology

Treble Technologies launches cloud SDK to provide sound simulation and spatial audio capabilities

Embedded & Programmable

Achronix unveils FPGA-powered automatic speech recognition solution

Internet of Things

Nordic expands Bluetooth LE portfolio

Sensors

Quantum Scan sensor set to revolutionise quality control for electronic components

Sensors

Boréas HapticStudio SDK lets designers create haptic effects in consumer electronics

ASIC & SoC

SiFive announces solutions for Generative AI and ML applications

Embedded Systems

SolidRun unveils Hummingboard 8P Edge AI SBC

Electronics

Electronic waste – more recycling needs to be encouraged

Internet of Things

GlobalScale launches Energy Harvesting Bluetooth LE 5.3 module

Power

Neutron Controls and Infineon develop automotive battery management platform

Artificial Intelligence

AMD to acquire Open-Source AI software expert Nod.a