Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

GF announces 9SW RFSOI technology for mobile and 5G applications

Power

Halo Microelectronics introduces 3A I2C controlled single-cell battery charger

Embedded & Programmable

GOWIN and Andes Technology unveil RISC-V CPU and subsystem embedded 22nm SoC FPGA

Automotive

BorgWarner to integrate ST’s SiC technology into Viper power modules

EDA & Design Software

DVCon Europe announces keynotes for 10th anniversary conference

Electronics

Farnell research shows engineers trust AI to select components - up to a point

Power

Toshiba releases 3rd generation SiC MOSFETs with reduced switching losses

Power

Ambient Photonics and e-peas to develop power solutions for connected devices

RF & Microwave

TRIAD streamlines edge processing of data in phased-array antennas

Internet of Things

Winbond and Mobiveil collaborate on ultra-low power applications

Artificial Intelligence

Voxel AI increases funding to $30m with latest strategic funding round

EDA & Design Software

Cadence and Arm to accelerate data centre design using Neoverse V2 platform