The two companies are developing a new IP controller targeting various applications such as Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless Headsets, Smart Speakers, and Connectivity.
Mobiveil has adapted its HYPERRAM Controller to leverage the characteristics of Winbond's new HYPERRAM device that reaches speeds of up to 250MHz and supports densities from 32Mb to 512Mb in x8/x16 modes.
Integrating Mobiveil's HYPERRAM controller to interface with Winbond's 250MHz HYPERRAM device will provide SoC designers with high performance at very low power, according to the two companies.
The ultra-low power consumption of HYPERRAM is intended for battery-operated applications, extending standby time. The low pin count of the HYPERRAM design allows for space-saving, making it suitable for applications with space constraints.
"The HYPERRAM supports the HYPERBUS Interface, enabling speeds of up to 500Mbps (x8 I/O) with just 13 signal pins," said Mobiveil CEO Ravi Thummarukudy.
The HYPERRAM controller provides support for AXI Memory-Mapped system interfaces, Linear/Hybrid/Wrap burst support, low power features like deep power-down and hybrid sleep mode. It also supports AMBA AHB-Lite system interfaces.
"Winbond's HYPERRAM is designed to enhance the IoT experience for end-users and provide a cost-effective, ultra-low power memory solution to system designers," said Hsiang-Yun Fan, DRAM Vice President of Winbond.
