Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Winbond joins UCIe Consortium to support chiplet interface standardisation

Artificial Intelligence

AI remains a ‘sea of dudes’

5G

Arctic Semiconductor ships IceWings, its first 5G RF chipset

Automotive

ServCity consortium brings autonomous mobility a step closer to deployment in UK’s cities

Memory

The Six Semiconductor announces tape-out of two 7nm test chips

EDA & Design Software

Tachyum validates Prodigy Universal Processor with Kubernetes

Sensors

Oculi forms strategic partnership with GlobalFoundries

EDA & Design Software

Cadence delivers 13 new VIP solutions

System Design

Endura precision timing solution enables faster GPS signal acquisition

Electronics

Texas Instruments selects Utah for its next 300mm wafer fab

Electronics

The promise of a fully connected society

Memory

Alliance Memory expands CMOS DDR4 SDRAMs line-up