Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

SkyWater to use CHIPS funding to enhance domestic production and capabilities

Education

Tektronix offers educators special pricing and extended protection on select oscilloscopes

Power

HMI unveils advanced hot-swap/E-Fuses enabling more efficient power management

Electronics

Broadcom delivers industry’s first 3.5D F2F technology for AI XPUs

Memory

X-FAB announces major breakthrough in NVM data storage

Electronics

YorChip and Digitho developing 2D chiplet packaging for mass markets

Manufacturing

Nvidia lays the foundations for continued success

Power

50W to 150W power supply series with option for push-in wire terminations

Electronics

GF GaN chip manufacturing receives $9.5mn in Federal funding

Automotive

Nexperia launches miniaturised leadless logic ICs for automotive applications

Interconnection

Micro RF connector offers enhanced board design flexibility

Electronics

Semiwise unveils Virtual Reality Semiconductor Fabrication Training Facility (VRSFT)